SN 100 C - Patent Information

Confirmation of Nihon Superior US & Japan Patents

The United States Patent & Trademark Office has issued formal confirmation of Nihon Superior’s Patent #6‚180‚055 for their unique tin-copper-nickel lead-free solder. This confirmation‚ issued after due consideration of a request for a re-examination‚ has considerably strengthened that patent.

The Japan Patent Office decided that the demand for a trial for invalidity for Japan Patent #3152945 covering Nihon Superior’s tin-copper-nickel lead-free solder has been dismissed. That means in effect that the patent has been confirmed as valid by the Japan Patent Office.

These confirmations by two independent and highly regarded patent offices should put beyond doubt the originality and technical validity of Nihon Superior’s invention of a unique cost-effective and user-friendly lead-free solder based on the tin-copper-nickel alloy system.

The United States and Japan are two of the 24 countries that have now granted a patent for Nihon Superior’s tin-copper-nickel lead-free solder. These decisions by the United States Patent & Trademark Office and the Japan Patent Office mean that Nihon Superior’s tin-copper-nickel alloys can be used globally with an even greater sense of security than previously.

With this important confirmation in place Nihon Superior will be working even harder to build global sales of products based on this patent.

Nihon Superior wishes to make it clear that the manufacture‚ sale or use of any products which fall within the scope of our patent except under the terms of a properly issued license will constitute an infringement of that patent. Nihon Superior therefore advises that manufacturers‚ sellers and users of soldering materials exercise the utmost care when dealing with products similar to the alloy cover by our patent.

We would like to take this opportunity of expressing our sincere appreciation of your continued business and support.